Direct measurements of thermal transport in glass and ceramic microspheres embedded in an epoxy matrix

The time-domain thermoreflectance metrology is applied to evaluate the thermal conductivities of filler particles embedded in a composite matrix. Specifically, system glass and ceramic microspheres with diameter 100 150 μm an epoxy matrix was used as representation typical interface material (TIM) suitable for microelectronics applications. These measurements provide direct characterization properties materials. measured both borosilicate yttria stabilized zirconia agree well literature values bulk materials, whereas conductivity alumina nearly 50% lower than that crystals. reduction highlights how important this level understanding TIM development attributed enhanced phonon scattering due structural heterogeneity, such defects induced by phase mixing microvoids. Combining sample preparation, characterization, measurements, our study reveals structure–thermal property relationship individual microspheres. results work can facilitate design engineering composite-based thermally conductive materials management